The DC technology is based on a combination of two physical processes — destruction and purposeful plastic deformation of the workpiece material. In other words, the surface layer of the material is trimmed, while remaining connected to the workpiece.
This technology allows to create a fin as thin as 0.1 mm with a 0.1 mm channel and 3 mm height on such materials as copper, aluminum and their alloys, titanium, steel, plastics, etc., with the possibility of increasing the surface area after processing up to 12 times. Compared to traditional skiving this cutting method is faster and more cost-efficient which results in a lower cost of our systems.
GPU titan Jensen Huang recently testified to the potential of this type of equipment.
Due to a large increase in the surface area heat is dissipated fast enough to keep GPU & CPU temperatures within a safe range even at 24/7 operation and prevent thermal throttling. This advantage is used in engineering water cooling systems for microprocessors, and makes our water blocks extremely efficient.